IC Substrate Vertical Plasma Equipment
IC Substrate Vertical Plasma Equipment is specifically designed for cleaning IC substrates in traditional IC packaging processes, effectively removing particles, oils, and surface contaminants to provide a high-quality surface for subsequent packaging steps. The system supports fully automated operation with touch screen and PLC control, enabling comprehensive management of process parameters, real-time monitoring, recipe management, and alarm notifications.
Function Description
IC Substrate Vertical Plasma Equipment is specifically designed for cleaning IC substrates in traditional IC packaging processes, effectively removing particles, oils, and surface contaminants to provide a high-quality surface for subsequent packaging steps. The system supports fully automated operation with touch screen and PLC control, enabling comprehensive management of process parameters, real-time monitoring, recipe management, and alarm notifications. It is stable, reliable, and easy to operate, meeting the high-precision and high-consistency requirements of IC packaging processes.
Main Components (Configuration)
Vacuum Solenoid Valves
High-quality SVF brand solenoid valves ensure rapid response and stable control of the vacuum chamber gas flow.
Pressure Switches and Regulators
SMC brand high-precision pressure switches and regulators provide accurate control of vacuum and gas pressure, maintaining consistent process performance.
Electrode Design
The electrodes are made from a single solid aluminum plate with a hollowed center, and the cooling channels use deep-drilled holes combined with strategically placed flow baffles to guide cooling water along a defined path. This ensures uniform electrode temperature, improving plasma treatment consistency and repeatability.
Main Applications
The equipment is mainly used for IC substrate cleaning, precisely controlling the plasma environment to remove fine particles, residual resin, and organic contaminants. It enhances IC packaging yield and product consistency. The system is compatible with substrates of various sizes and materials, meeting the stringent cleanliness and process precision requirements of the electronics packaging industry.
Technical Specifications
Vacuum Level
Maintains 20–50 Pa during normal operation, ensuring a stable plasma treatment environment.
Gas Flow Method
Utilizes a patented top-inlet, bottom-exhaust design with flow baffles to guarantee uniform airflow within the chamber and consistent treatment results.
Cooling System
Electrode cooling channels are designed with deep-drilled holes and flow baffles to guide water along a prescribed path, ensuring uniform electrode temperature and improving plasma treatment stability and repeatability.
Application Value
The IC substrate vertical plasma equipment provides a highly efficient, stable, and intelligent surface cleaning solution. By optimizing vacuum airflow and electrode cooling design, it significantly improves IC packaging yield and product consistency while reducing process defects and production waste. The system is easy to operate and maintain, energy-efficient, and environmentally friendly, making it a key asset for IC packaging manufacturers seeking to enhance productivity, ensure consistent quality, and maintain process stability.
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