Eighteen Layers Vertical Plasma Equipment
Eighteen-Layer Vertical Plasma Equipment can be seamlessly integrated with MES systems and barcode scanning functions, enabling upper-computer control, recipe retrieval, and full process traceability. Production data can be monitored and recorded in real time, helping customers achieve refined production management and strict quality control.
Function Description
Eighteen-Layer Vertical Plasma Equipment can be seamlessly integrated with MES systems and barcode scanning functions, enabling upper-computer control, recipe retrieval, and full process traceability. Production data can be monitored and recorded in real time, helping customers achieve refined production management and strict quality control. The system also features real-time monitoring, automatic alarm functions, and recipe & permission management, allowing quick switching between multiple batches and processes while ensuring safe and stable operation. These intelligent capabilities significantly improve efficiency and flexibility in high-volume manufacturing environments.
Main Components (Configuration)
Vacuum Pipeline System
Equipped with Ningbo Hongke DDC-JQ160 vacuum solenoid valves and corrosion-resistant stainless steel pipelines to ensure high airtightness, durability, and long-term operational stability.
Display & Control System
Features an industrial-grade touch screen + PLC closed-loop control, offering an intuitive user interface with highly automated process management for easy operation and training.
Main Applications
This equipment is mainly designed for HDI (High-Density Interconnect) desmear processes. Plasma treatment effectively removes resin residues left after mechanical or laser drilling, ensuring clean and roughened hole walls. This greatly enhances the reliability and bonding strength of subsequent metallization. It is particularly critical for advanced PCB manufacturing in industries such as smart devices, 5G communication, and semiconductor packaging substrates, where high precision and high-density interconnections are required.
Technical Specifications
Cooling System: Utilizes a dual-waterway design, providing independent cooling for both the vacuum chamber and the dry vacuum pump. This ensures stable processing performance even during extended operation, while also extending the lifespan of critical components.
Application Value
The eighteen-layer vertical plasma equipment offers large-scale processing capacity and high automation, making it an ideal solution for advanced PCB and HDI manufacturing. It ensures stable, consistent desmear performance, while MES and barcode integration deliver full production traceability and enhanced process control. With high-quality core components and an optimized cooling system, the equipment achieves stable operation, energy efficiency, environmental friendliness, and ease of maintenance. For PCB manufacturers striving for high yield, reliability, and market competitiveness, this system is a key asset to meet both current and future demands.
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