LCD RF Plasma Equipment

The LCD RF Plasma Equipment is a high-performance system developed for the surface treatment of LCD, OLED, and other flat panel display materials. It is designed to meet the rigorous demands of modern manufacturing, where stable processing and high throughput are equally important. The overall system measures 880mm × 790mm × 1710mm, with a vacuum chamber size of 450mm × 450mm × 450mm. Each electrode plate is 410mm × 430mm, and up to five layers of substrates can be processed simultaneously in a single cycle.

 

From a functional perspective, the equipment provides a user-friendly HMI that allows direct adjustment of key process parameters such as RF output power, vacuum pumping duration, individual treatment segments, and gas flow rates. These settings can be modified quickly to adapt to different materials or process requirements, offering both flexibility and consistency for industrial operations.

The gas delivery system supports three independent channels and can handle nitrogen (N₂), argon (Ar), hydrogen (H₂), and oxygen (O₂). Flow meters are calibrated within a 0–200 ml/min range, with control accuracy keeping fluctuations below 5%. All major pneumatic components are supplied by SMC, and the chamber sealing relies on durable fluoro-rubber gaskets, ensuring long-term stability in demanding environments. Plasma is generated through a self-adaptive RF power supply operating at 13.56 MHz, with a maximum output of 1 kW, guaranteeing reliable energy delivery for uniform treatment.

Structurally, the chamber is manufactured from high-purity 304 stainless steel to minimize oxidation and corrosion. The system employs a dual-seal design for vacuum integrity, while copper electrode holders at the rear of the chamber secure horizontal electrode plates through multiple screw locks, improving stability and energy transfer. Additional side supports further reinforce the electrodes. Vacuum balance has been optimized: a rapid-release valve allows pressure equalization within 5–10 seconds, reducing idle time and boosting productivity.

To ensure operational safety, the machine is equipped with a fault alarm system. It logs the date, time, and cause of any abnormal event, while automatic shutdown is triggered to protect both the chamber and the workpieces.

In terms of application, this equipment is widely adopted for flip-chip underfill processes. Plasma cleaning prior to underfill significantly enhances surface activation, improves wettability, and increases adhesion between the substrate and encapsulant. As a result, it not only improves packaging quality but also enhances the long-term reliability of advanced display and semiconductor assemblies.

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