Twenty Layers Vertical Plasma Cleaner
Supports seamless switching between manual and fully automatic modes with PLC closed-loop control, allowing precise, reliable operation. Features fully automatic operation, integrated alarm functions, real-time monitoring, recipe management, and password protection for secure process management.
Function Description
Supports seamless switching between manual and fully automatic modes with PLC closed-loop control, allowing precise, reliable operation. Features fully automatic operation, integrated alarm functions, real-time monitoring, recipe management, and password protection for secure process management. The system continuously records total machine operating time for preventive maintenance, process tracking, and operational analysis. Users can adjust and monitor all critical parameters, including plasma power, gas flow rates, vacuum level, and processing time, through the HMI interface. The machine is designed to provide high stability, repeatability, and safety during continuous industrial or laboratory operation.
Main Components (Configuration)
Display & Control System: Touchscreen interface with PLC closed-loop control for intuitive operation and precise process adjustments.
Programmable Controller: Mitsubishi Q00UJCPU with expansion module Q68ADV for reliable industrial automation.
Plasma Generator: ATV-MFPS-10, 0–10 kW ±2% continuously adjustable power.
Pressure Transmitter: High-accuracy vacuum sensor for real-time monitoring.
Electrical Components: Schneider LC1D0845 contactors and other industrial-grade components.
Temperature Transmitter: S4-TT-R-I-3-5 for precise temperature feedback.
Switching Power Supply: IQ-60F (±15V/24V) for stable operation.
Vacuum Solenoid Valve: SVF for controlled gas flow and pressure regulation.
Pressure Switch & Regulator: SMC for reliable pressure management.
Cooling Water System: U.S. Hub Wheel compressor with imported stainless steel pump and piping, using eco-friendly refrigerant for safe and efficient heat management.
Main Applications
Designed for cleaning, degumming, and surface activation of PCB, PTFE materials, FPC, and other sensitive substrates in electronics, materials research, and advanced manufacturing industries.
Technical Specifications
Vacuum Chamber Pumping Time: ≤180 s.
Maximum Gas Inlet: ≤2000 ml/min.
Gas Channels: 4 independent channels for flexible multi-gas operation.
Working Gases: Nitrogen, Oxygen, Hydrogen, Argon (4 channels), Japanese brand: Kojima; flow meter accuracy ±1.5% F.S., repeatability ±0.2% F.S., FKM sealing, range 0–2000 ml/min.
Plasma Generator: ATV-MFPS-15 (ATV proprietary brand), 0–15 kW ±2% continuously adjustable.
Processing Time: 20–60 min.
Cooling Water Pressure: >1 bar.
Vacuum Level During Normal Operation: 20–50 Pa.
Cooling Design: Two independent water circuits separately supply the vacuum chamber and dry pump to ensure optimal cooling performance, uniform temperature distribution, and stable long-term operation.
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